Samsung Electronics has announced that it has developed the first LPDDR5X DRAM capable of achieving data transfer speeds of up to 10.7 Gbps, which is higher than both the 6.4 Gbps LPDDR5X chip launched in 2021 and the 8.5 Gbps LPDDR5X DRAM chip launched in 2022.
This new DRAM LPDDR5X was built on a 12-nanometer (nm) manufacturing process, which is far ahead of SoCs in memory, allowing Samsung to achieve the smallest chip size among existing LPDDRs.
In addition to improving performance by more than 25% and capacity by more than 30% compared to the previous generation, the Korean company’s 10.7 Gbps LPDDR5X also expands the capacity of the single mobile DRAM package up to 32 gigabytes (GB), making it an optimal solution for “on-device” artificial intelligence, i.e. processing directly on devices. which is becoming more and more crucial and which requires high-performance, high-capacity, and low-power memory.
In particular, Samsung’s DRAM LPDDR5X integrates technologies developed specifically to allow significant energy savings. These include one that optimizes power by adjusting it according to the workload, and one that activates longer low-power mode intervals to extend periods of power savings.
These improvements improve energy efficiency by 25 percent compared to the previous generation, allowing mobile devices to provide longer battery life and allowing servers to minimize the total cost of ownership (TCO) by decreasing power consumption during data processing.
According to YongCheol Bae, executive vice president of memory product planning for the memory industry at Samsung Electronics, as the demand for low-power and high-performance memory increases, LPDDR DRAM is expected to expand its applications primarily from mobility to other areas that traditionally require higher performance and reliability such as PCs. accelerators, servers, and cars.
Mass production of the 10.7 Gbps LPDDR5X is expected to begin in the second half of the year, subject to verification with mobile application (AP) processor and mobile device vendors. Actual usage could occur at the same time as next-generation high-end SoCs.
